Comparison of chemical-mechanical polishing processes

Details Comparison of chemical-mechanical polishing processes Comparison of chemical-mechanical polishing processes

2005-10-18

2005-10-18

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S005000, C438S008000, C438S014000, C438S926000, C216S084000, C216S088000, C451S005000, C451S041000, C451S057000

Reexamination Certificate

active

06955987

ABSTRACT:
Chemical-mechanical polishing (“CMP”) processes performed on bodies (10), each having areas (16and18) of different depression pattern densities, are compared by correlating polishing data accumulated, for one such body, on an area (16) of one pattern density to polishing data accumulated, for that body, on an area of another pattern density for each of the CMP processes.

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