Comparing on die response and expected response applied to...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

10806546

ABSTRACT:
A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

REFERENCES:
patent: 5434513 (1995-07-01), Fujii et al.
patent: 5912563 (1999-06-01), Garnett
patent: 6215324 (2001-04-01), Yoshida
patent: 6560734 (2003-05-01), Whetsel
patent: 6643810 (2003-11-01), Whetsel
patent: 6717429 (2004-04-01), Whetsel
patent: 6894308 (2005-05-01), Whetsel et al.
patent: 2002/0075740 (2002-06-01), Sung et al.
patent: 2003/0046622 (2003-03-01), Whetsel
patent: 2003/0197520 (2003-10-01), Rearick et al.
patent: 2005/0204217 (2005-09-01), Whetsel et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Comparing on die response and expected response applied to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Comparing on die response and expected response applied to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Comparing on die response and expected response applied to... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3818865

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.