Compacted polishing pads for improved chemical mechanical...

Details Compacted polishing pads for improved chemical mechanical... Compacted polishing pads for improved chemical mechanical...

2006-06-13

2006-06-13

Wilson, Lee D. (Department: 3723)

Abrading

Machine

Rotary tool

C451S041000, C451S060000, C451S290000, C428S304400, C428S314400, C204S157970, C051S298000

Reexamination Certificate

active

07059946

ABSTRACT:
The present invention is directed, in general, to a chemical mechanical polishing pad comprising a polishing body and a backing material coupled to the polishing body. The polishing body comprising a compacted thermoplastic foam substrate, wherein the compacted thermoplastic foam substrate has a density that is as at least about 1.1 times greater than an uncompacted thermoplastic foam substrate density. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.

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