Compact via transmission line for printed circuit board and...

Details Compact via transmission line for printed circuit board and... Compact via transmission line for printed circuit board and...

2004-06-01

2008-12-09

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S033000

Reexamination Certificate

active

07463122

ABSTRACT:
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

REFERENCES:
patent: 5668509 (1997-09-01), Hoffmeister et al.
patent: 6388206 (2002-05-01), Dove et al.
patent: 6486414 (2002-11-01), Kobayashi et al.
patent: 4-257287 (1992-09-01), None
patent: 6-37416 (1994-02-01), None
patent: 11-284414 (1999-10-01), None
patent: 2000-246510 (2000-08-01), None
patent: 2001-127439 (2001-05-01), None

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