Compact, thermally efficient focal plane array and testing and r

Details Compact, thermally efficient focal plane array and testing and r Compact, thermally efficient focal plane array and testing and r

1990-04-05

1992-09-08

Jackson, Jr., Jerome

357 40, 357 45, 357 68, 357 83, H01L 2714, H01L 3100

Patent

active

051463032

ABSTRACT:
In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.

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