Compact stabilized full-band power amplifier arrangement

Wave transmission lines and networks – Plural channel systems – Having branched circuits

Reexamination Certificate

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C333S034000, C333S136000, C333S137000, C330S286000, C330S296000

Reexamination Certificate

active

07446627

ABSTRACT:
High frequency power amplification modules comprise a dielectric substrate supporting a stepped impedance transition coupled to the input of a power amplifier and a symmetrically disposed stepped impedance transition connected to the output of the power amplifier. The power amplification modules are oriented in an electromagnetic energy field so that input electromagnetic energy is coupled to the input of the power amplifier by the input side stepped impedance transition, amplified by the amplifier, and emitted from the module by the output side stepped impedance transition. A plurality of the power amplification modules may be organized into an array to provide a power combiner. The power amplification modules in the array may be linked by isolation impedances that decouple the modules in the array.

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Collin, Robert E., Foundations for Microwave Engineering, 1992, pp. 205-210 and 442-450, McGraw-Hill, Inc., New York, NY.
Maloratsky, Leo G., Reviewing the Basics of Microstrip Lines, Microwaves & RF, Mar. 2000, pp. 79, 80, 82, 84, 86, and 88.

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