Compact silicon module for high density integrated circuits

Details Compact silicon module for high density integrated circuits Compact silicon module for high density integrated circuits

1989-09-06

1991-08-13

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 361414, H01L 3902

Patent

active

050400525

ABSTRACT:
A semiconductor module that densely packs integrated circuit chips to provide electronic systems or large memory modules in an array of stacked silicon boards. The semiconductor chips may be flip mounted and the back side of each chip is in thermal contact with an adjacent silicon board to provide heat conduction away from the chip.

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Crawford et al., IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, pp. 4771-4773, "High Density Multilayer Ceramic Module".

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