Compact resin-sealed semiconductor device

Details Compact resin-sealed semiconductor device Compact resin-sealed semiconductor device

1997-12-08

2000-07-04

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257737, 257738, 257666, 257692, 257693, H01L 2348, H01L 2328

Patent

active

060843004

ABSTRACT:
A semiconductor device of the present invention is structured such that solder balls for packaging are fixed onto leads protruding from a package to obviate drawbacks inherent in the conventional lead frame type semiconductor device, wherein it is difficult to correspond to the layout of the increased number of pins due to an occurrence of flexure of the lead, and protrusions of the lead terminals from the package resin are disadvantageous for downsizing.

REFERENCES:
patent: 5045914 (1991-09-01), Casto et al.
patent: 5433822 (1995-07-01), Mimura et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5594275 (1997-01-01), Kwon et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5677566 (1997-10-01), King et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5751060 (1998-05-01), Laine et al.
patent: 5777387 (1998-07-01), Yamashita et al.
patent: 5847455 (1998-12-01), Morheghi
patent: 5886399 (1999-03-01), Ohsawa et al.
patent: 5895965 (1999-04-01), Tahaka et al.
patent: 5900675 (1999-05-01), Appalt et al.
patent: 5901041 (1999-05-01), Davies et al.
Patent Abstracts of Japan vol. 011, No. 390 (E-567), Dec. 19, 1987 & JP 62 154657 A (Sumitomo Electric Ind Ltd), Jul. 9, 1987, *abstract*.
Patent Abstracts of Japan vol. 097, No. 004, Apr. 30, 1997 & JP 08 330463 A (NEC Kyushu Ltd), Dec. 13, 1996, *abstract*.
Patent Abstracts of Japan vol. 097, No. 002, Feb. 28, 1997 & JP 08 274219 A (Seiko Epson Corp), Oct. 18, 1996, *abstract*.

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