Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-10-18
1995-03-14
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257711, 257713, 361719, 361761, H05K 720
Patent
active
053981600
ABSTRACT:
In a power module having at least one power device chip and circuits for driving and controlling the power device chip which are incorporated within one and the same package, a heat spreader which is constituted by a material having a heat dissipation property and supports the power device chip on its upper surface is inserted into an opening formed in a control substrate having an upper surface on which patterns for forming the chip driving and controlling circuits and a connection pattern for connection with the power device chip are printed, and the control substrate and the heat spreader inserted into the opening are fixedly supported on a base substrate. Thus, the power device chip and the control substrate can be disposed in plane and reduced in size.
REFERENCES:
patent: 4521476 (1985-06-01), Asai
patent: 4924351 (1990-05-01), Kato
patent: 5095404 (1992-03-01), Chao
patent: 5198964 (1993-03-01), Ito
patent: 5245510 (1993-09-01), Honda
patent: 5272375 (1993-12-01), Belopolsky
patent: 5287247 (1994-02-01), Smits
Fujitsu General Limited
Tolin Gerald P.
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