Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool
Patent
1979-02-13
1981-05-19
Arnold, Donald J.
Abrasive tool making process, material, or composition
Impregnating or coating an abrasive tool
51307, 51309, 264332, B24D 308
Patent
active
042682762
ABSTRACT:
In one embodiment, a compact for tools, such as cutting, drilling, wire drawing and shaping tools, consists essentially of a porous mass of self-bonded, boron-doped diamond particles and a catalyst-solvent material. The method for making such a compact comprises the steps of bonding a mass of boron-doped diamond particles, aided by a catalyst-solvent material, under high temperatures and high pressures (HP/HT).
In another embodiment, a composite compact, which is made in a similar manner to the first embodiment, consists essentially of (i) a layer of a porous mass of self-bonded, boron-doped diamond particles and catalyst-solvent material; and (ii) a substrate layer of cemented carbide bonded to the diamond layer.
REFERENCES:
patent: 3141855 (1964-07-01), Wentorf, Jr.
patent: 3148161 (1964-09-01), Wentorf, Jr. et al.
patent: 3407445 (1968-10-01), Strong
patent: 3574580 (1971-04-01), Stromberg et al.
patent: 3609818 (1971-10-01), Wentorf, Jr.
patent: 3744982 (1973-07-01), Bovenkerk et al.
patent: 3745623 (1973-07-01), Wentorf et al.
patent: 3785093 (1974-01-01), Vereschagin et al.
patent: 3831428 (1974-08-01), Wentorf et al.
patent: 3913280 (1975-10-01), Hall
Nature, vol. 210, No. 5031, pp. 90-91, Apr. 2, 1966.
Arnold Donald J.
Dearing D. A.
General Electric Company
Little Douglas B.
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