Compact light emitting device package with enhanced heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...

Reexamination Certificate

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Details

C257S081000, C257S099000, C257S100000, C257S085000, C257S094000, C257S676000, C257S692000, C257S696000

Reexamination Certificate

active

07385227

ABSTRACT:
A light emitting device package and method for making the package utilizes a first leadframe having a first surface and a second leadframe having a second surface that are relatively positioned such that the second surface is at a higher level than the first surface. The light emitting device package includes a light source, e.g., a light emitting diode die, which is mounted on the first surface of the first leadframe and electrically connected to the second surface of the second leadframe.

REFERENCES:
patent: 6486543 (2002-11-01), Sano et al.
patent: 6603148 (2003-08-01), Sano et al.
patent: 6815249 (2004-11-01), Miura
patent: 2005/0253158 (2005-11-01), Yasukawa et al.

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