Compact integrated circuit package

Details Compact integrated circuit package Compact integrated circuit package

2006-05-30

2006-05-30

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S738000, C257S678000, C257S737000, C438S106000, C438S121000, C438S613000

Reexamination Certificate

active

07053473

ABSTRACT:
A method for making a semiconductor device includes mounting a die on a die-mounting substrate, providing an interposer on the substrate, forming a conductive strip that is laid on the interposer and that is electrically connected to a bonding pad of the die and to a contact of the substrate, forming an encapsulant layer on the interposer, and forming a solder bump that is electrically connected to the conductive strip and protrudes outwardly from the encapsulant layer.

REFERENCES:
patent: 6841413 (2005-01-01), Liu et al.
patent: 2004/0041271 (2004-03-01), Storli

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