Compact image sensor

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Details

357 72, 357 74, H01L 2714, H01L 2328, H01L 2302

Patent

active

050518020

ABSTRACT:
A compact image sensor is disclosed. This sensor comprises an insulating, imperviously sealed package, provided with a window which is transparent to light rays and is located on a front face. The inside of the package contains a stack arrangement which comprises, between the back of the package and the window, an insulating support, a set of photosensitive elements with a semiconducting substrate, surrounded by contacts. Connection terminals go through the back of the package and the insulating support. Connection means are interposed between these contacts and the ends of the terminals. The light rays are received by the photosensitive elements after they have crossed the semiconducting substrate which is thinned down beforehand. This arrangement of the photosensitive elements, the substrate and the connection means enables an appreciable increase in the area of the photosensitive surface and in the number of connection terminals, without an increase in the area of the front surface of the sensor.

REFERENCES:
patent: 3456159 (1969-07-01), Davis et al.
Patents Abstracts of Japan, vol. 7, No. 123 (E-178)[1268], May 27, 1983.
Patent Abstracts of Japan, vol. 8, No. 139 (E-253)[1576], Jun. 28, 1984.
Patent Abstracts of Japan, vol. 7, No. 214 (E-199)[1359], Sep. 21, 1983.

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