Compact high power modular RF semi-conductor systems packaging

Details Compact high power modular RF semi-conductor systems packaging Compact high power modular RF semi-conductor systems packaging

1988-11-25

1989-10-10

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 330 66, 357 82, H05K 720

Patent

active

048736139

ABSTRACT:
There is disclosed a compact high power modular RF Semi-Conductor systems package suitable for constructing RF sources of high power and compact size comprising a liquid coolant conduit incorporating side-by-side input and discharge conduits, said conduit attached at one end to a master coolant conduit; liquid cooled microwave semi-conductor device modules comprising input and output liquid coolant connectors at one end and RF output coupling means at the other end, said modules being mounted on two opposing surfaces of said liquid conduit there being multiple adjacent modules in close proximity to each other on each side, and along the length of said conduit, each module having input and discharge liquid couplers fastened respectively to corresponding input and discharge conduits of said conduit, there being RF coupling means mounted on the opposing ends of said module from said coolant connectors, said RF coupling means joining adjacent modules in such manner that the sum of the RF power output of all modules on each side of said conduit transmitted through successive couplers is additive and is substantially equal to the power delivered from the last coupler into an output wave guide or other RF transmission means;

REFERENCES:
patent: 4712609 (1987-12-01), Iverson
patent: 4724901 (1988-02-01), Munekawa
patent: 4774630 (1988-09-01), Reisman

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