Compact high density interconnected microwave system

Details Compact high density interconnected microwave system Compact high density interconnected microwave system

1990-04-05

1994-09-06

Issing, Gregory C.

Wave transmission lines and networks

Long line elements and components

Strip type

361749, 29829, H01P 308, H05K 100

Patent

active

053452054

ABSTRACT:
A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.

REFERENCES:
patent: 3152288 (1964-10-01), Mittler
patent: 3248779 (1966-05-01), Yuska et al.
patent: 3766439 (1973-10-01), Isaacson
patent: 3873889 (1975-03-01), Leyba
patent: 3971127 (1976-07-01), Giguere et al.
patent: 4490721 (1984-12-01), Stockton et al.
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4591814 (1986-05-01), Ito et al.
patent: 4716259 (1987-12-01), Tokura et al.
patent: 4792879 (1988-12-01), Baukrecht et al.
patent: 4816836 (1989-03-01), Lalezari
patent: 4967201 (1990-10-01), Rich, III
patent: 5005019 (1991-04-01), Zaghloul et al.

Affiliated with

Also associated with

Rating

Compact high density interconnected microwave system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compact high density interconnected microwave system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compact high density interconnected microwave system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1332095