Compact high density interconnect structure

Details Compact high density interconnect structure Compact high density interconnect structure

1990-07-02

1993-08-31

Donovan, Lincoln

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174250, 174260, 174261, 257685, 257686, 257688, 257700, 439 68, 361730, 361744, 361761, 361807, H05K 100, H01L 23043, H01L 23051, H01L 23053

Patent

active

052414566

ABSTRACT:
An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers. In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate. Substrates of either of these types may be stacked to form a three-dimensional structure. Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof.

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