Compact heated air manifolds for adhesive application

Details Compact heated air manifolds for adhesive application Compact heated air manifolds for adhesive application

2002-10-29

2009-11-17

Shaver, Kevin P (Department: 3754)

Dispensing

With heating or cooling means

Heating only

C222S146500, C425S072100

Reexamination Certificate

active

07617951

ABSTRACT:
A heated air manifold of reduced physical dimensions for heating process air for use in dispensing heated liquids, such as hot melt adhesives. The heated air manifold includes at least one heating element and an air plenum having an air inlet and an air outlet. The dimensions of the air plenum are optimized for providing a compact heated air manifold for use in various adhesive dispensing systems, such as systems assembled from modular adhesive manifold segments, while retaining the ability to heat the process air in the air plenum to a desired application temperature. The heated air manifold may include a thick film flat heater disposed in the air plenum. The air plenum may have multiple individual segments winding throughout the volume of the heated air manifold.

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