Compact encapsulated filter assembly for printed circuit boards

Details Compact encapsulated filter assembly for printed circuit boards Compact encapsulated filter assembly for printed circuit boards

1987-09-30

1990-03-13

Laroche, Eugene R.

Wave transmission lines and networks

Coupling networks

Frequency domain filters utilizing only lumped parameters

333185, 361400, H03H 701

Patent

active

049085867

ABSTRACT:
An improved filter assembly (10) for filtering RFI/EMI in printed circuit boards is disclosed, together with methods of manufacture thereof. A filter sleeve (16) is carried by an outer leg (11) of the filter assembly and is substantially parallel to the respective legs (11, 12, 13) thereof, thereby providing a compact structure for improved circuit miniaturization. The filter assemblies are encapsulated with a suitable insulating material (17). The respective filter assemblies (10) are made in a continuous strip, suitably stamped, and broken off as desired by the user. In a further embodiment, the respective filter assemblies are made from a continuous wire, suitably bent and formed, and cut off as desired.

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patent: 4563659 (1986-01-01), Sakamoto
patent: 4695105 (1987-09-01), Ney et al.
AMP Shielded & Filtered Products for EMC 82-683-issued 5/83.
AMP Quiet Line Filter Products 78-487, Revised 11-86.

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