Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-19
1999-08-03
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
310366, H01R 909
Patent
active
059316845
ABSTRACT:
An element connection assembly for connecting elements of an ultrasonic transducer stack mounted on a frame to wires of a cable and having a plurality of transmitting and receiving elements and including a element lead assembly and a connection assembly. The element lead assembly has a plurality of leads connected to the element connections, is located along a first side of the frame and includes a first and second lead zone areas spaced apart transverse to the longitudinal axis of the frame and separated by a folding line. Groups of leads are routed through corresponding lead zone areas and turn through a right angle to pass across the first lead zone area transverse to the longitudinal axis of the frame and there is a connection pad for connecting each lead to a wire of the cable. The element lead assembly is folded along the folding line so that the second lead zone area is superimposed over the first lead zone area so that the width of the element lead assembly along the frame is equal to or less than the width of the connection side of the frame. The element lead assembly includes a third lead zone wherein the leads are connected to the corresponding connection pads on a second side of the frame and a connector for connecting the wires of the cable to the leads and may include a second element lead assembly and connection assembly located on an opposite side of the frame.
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Garrison Brevard S.
Mooney Matthew
Obendorf William D.
Abrams Neil
Hewlett--Packard Company
Patel T C
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