Compact disc injection molding apparatus

Details Compact disc injection molding apparatus Compact disc injection molding apparatus

1994-07-22

1996-12-31

Heitbrink, Tim

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

With means to heat or cool

425810, B29C 4520

Patent

active

055892060

ABSTRACT:
A highly reliable molding architecture which includes a two-zoned hot sprue bushing with an interchangeable tip for use in controlling the temperature of plasticized material while it flows from the injection nozzle to the gates of a cavity mold for fabricating flat, thin objects such as compact discs and the like. Advantageously, the hot sprue bushing is adjustable in length so that it can be used with a full range of standard or custom mold plate thicknesses or other required lengths, and the interchangeable tip does not require separate heating and temperature control. With the system and its hot sprue delivery system, compact disc defect levels and scrap losses are reduced.

REFERENCES:
patent: 4034952 (1977-07-01), Stewart
patent: 4266723 (1981-05-01), Osanu-Diaz
patent: 4273525 (1981-06-01), Reitan
patent: 4309163 (1982-01-01), Cottancin
patent: 4563149 (1986-01-01), Landis
patent: 4593182 (1986-06-01), Schwarzkoff
patent: 4666396 (1987-05-01), Shaw
patent: 4882469 (1989-11-01), Trakas
patent: 4961884 (1990-10-01), Watanabe et al.
patent: 5092758 (1992-03-01), Tanaka et al.
patent: 5232710 (1993-08-01), Miyazawa et al.
patent: 5234336 (1993-08-01), Hosokawa et al.
patent: 5330693 (1994-07-01), Takada
patent: 5334006 (1994-08-01), Hepler et al.

Affiliated with

Also associated with

Rating

Compact disc injection molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compact disc injection molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compact disc injection molding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1140333