Compact adapter package providing peripheral to area translation

Details Compact adapter package providing peripheral to area translation Compact adapter package providing peripheral to area translation

1994-06-09

1995-01-03

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257778, 361749, 361760, 361807, 437209, 439 68, 439 69, H05K 702, H01R 909

Patent

active

053791916

ABSTRACT:
An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vias extending through the support. The vias are connected at the upper surface to the second ends of the reroute lines. The vias are connected at the lower surface of the support to an area array of coupling elements. The pads and reroute lines can be fabricated on a tape-automated-bonding (TAB) frame support and personalized to match a particular configuration of terminals or bumps on a chip. The coupling elements can form a generic array compatible with a wide variety of interconnect substrates.

REFERENCES:
patent: T955008 (1977-02-01), Gregor et al.
patent: 3541222 (1970-11-01), Parks et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4195195 (1980-03-01), de Miramda et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4354107 (1982-10-01), Carson et al.
patent: 4403238 (1983-09-01), Clark
patent: 4498122 (1985-02-01), Rainal
patent: 4525921 (1985-07-01), Carson et al.
patent: 4551629 (1985-11-01), Carson et al.
patent: 4617160 (1986-10-01), Belanger et al.
patent: 4631820 (1986-12-01), Harada et al.
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4706166 (1987-11-01), Go
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4764846 (1988-08-01), Go
patent: 4820013 (1989-04-01), Fuse
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4845335 (1989-07-01), Andrews et al.
patent: 4851862 (1989-07-01), Newman et al.
patent: 4860088 (1989-08-01), Smith et al.
patent: 4866841 (1989-09-01), Hubbard
patent: 4912545 (1990-03-01), Go
patent: 4922377 (1990-05-01), Matsumoto et al.
patent: 4926241 (1990-05-01), Carey
patent: 4926549 (1990-05-01), Yushizawa et al.
patent: 4954878 (1990-08-01), Fox et al.
patent: 4975765 (1990-12-01), Ackermann
patent: 4993954 (1991-02-01), Prevost
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5014161 (1991-05-01), Lee et al.
patent: 5029325 (1991-07-01), Higgins, III et al.
patent: 5061989 (1991-10-01), Yen et al.
patent: 5076485 (1991-12-01), Mackay
Fujitsu Single Chip Package, Nikkei Microelectronics, Jun., 1989, page unknown.
Fujitsu Advertisement, Electronic Design, Feb. 22, 1990, pp. 124-125.
Akihiro et al., "Packaging Technology For the NEC SX-3/SX-X Supercomputer", 40th Annual Electronic Components and Technology.
Watari et al, "Packaging Technology For the NEXC SX Supercomputer", IEEE Electronic Components Conference (1985), pp. 192-198.
NEC Flip Tab Carrier, Nikkei Microdevices, Jun. 1989, p. 58.
Moore et al, "Solder Joint Reliability of Fine Pitch Solder Bumped Pad Array Carriers," Proceedings of the 1990 International Society For Hybrid Microelectronics Conference, pp. 153-158.
Kyocera Advertisement, Electronic Engineering Times, Sep. 24, 1990, p. 63.
"Fine Pitch Technology: Leading SMT Components Into the '90s", Electronic Packaging & Production, vol. and date unknown, p. 16.
"TAB Technology Tackles High Density Interconnections," Electronic Packaging and Production, Dec. 1984, pp. 34-38.
Sakuma et al., "Chip On Glass Technology With Standard Aluminum IC Chip", International Society for Hybrid Microelectronics Conference Proceedings, Chicago, Ill., Oct. 13, 1990, pp. 250-256.
P. Hogerton et al., "Investigations Into the Use of Adhesives For Level-1 Microelectronic Interconnections," Materials Research Society Symposium Proceedings, vol. 154, San Diego, Calif., Apr. 24, 1989, pp. 415-424.
"CTM-TV2 Key Features and Benefits", promotional material supplied to MCC by CTM Electronics for Open Systems Project.
A. H. Johnson, "Wire Fan-Out Device Carrier", IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978.
J. Rasile et al., "Low-Cost Stacked Modules", IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979.
K. Hinrichsmeyer et al., "Solder-Filled Elastomeric Spacer", IBM Technical Disclosure Bulletin, vol. 27, No. 8, Jan. 1985.
Wessely et al., "Computer Packaging" Siemens Forsch-u. Entwickl.-Ber. Bd. 17 (1988) No. 5, pp. 234-239.

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