Commonly housed diverse semiconductor die

Details Commonly housed diverse semiconductor die Commonly housed diverse semiconductor die

1997-03-18

1998-09-29

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257497, 257685, 257773, 257901, H01L 2324, H01L 2348, H01L 2352

Patent

active

058148841

ABSTRACT:
A MOSFET die and a Schottky diode die are mounted on a common lead frame pad and their drain and cathode, respectively, are connected together at the pad. The pad has a plurality of pins extending from one side thereof. The lead frame has insulated pins on its opposite side which are connected to the FET source, the FET gate and the Schottky diode anode respectively by wire bonds. The lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface-mount package.

REFERENCES:
patent: 5083189 (1992-01-01), Savaya
patent: 5084753 (1992-01-01), Goida et al.
patent: 5200640 (1993-04-01), Scheftic et al.
patent: 5309020 (1994-05-01), Murasawa et al.
patent: 5332921 (1994-07-01), Dousen et al.
patent: 5544038 (1996-08-01), Fisher et al.

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