Combined semiconductor device and printed circuit board assembly

Details Combined semiconductor device and printed circuit board assembly Combined semiconductor device and printed circuit board assembly

1976-02-26

1977-10-18

Smith, Jr., David

Electricity: electrical systems and devices

Miscellaneous

29627, H05K 104

Patent

active

040549380

ABSTRACT:
A method for combining a semiconductor device with a printed circuit board or substrate which eliminates the need for conventional semiconductor packaging and connectors for same on the board and thereby makes possible a relatively small and thin assembly adaptable for space limited electronic products. The semiconductor device is fixed to a carrier which is installed and secured within a hold in the circuit board. Terminal pads of the device are wire bonded to terminals on the substrate, and the connecting wires and die are completely encapsulated within a plastic material.

REFERENCES:
patent: 2890395 (1959-06-01), Lathrop et al.
patent: 3206647 (1965-09-01), Kahn
patent: 3287795 (1966-11-01), Chambers
patent: 3381071 (1968-04-01), Logan et al.
patent: 3412788 (1968-11-01), Pomerantz
patent: 3549782 (1970-12-01), Reifeu
patent: 3622419 (1971-11-01), London et al.

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