Combined semiconductor apparatus with thin semiconductor films

Details Combined semiconductor apparatus with thin semiconductor films Combined semiconductor apparatus with thin semiconductor films

2007-07-03

2007-07-03

Pham, Hai (Department: 2861)

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C257S758000

Reexamination Certificate

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10705895

ABSTRACT:
A semiconductor apparatus includes two thin semiconductor films bonded to a substrate, and a thin-film interconnecting line electrically connecting a semiconductor device in the first thin semiconductor film to an integrated circuit in the second thin semiconductor film. The two thin semiconductor films are formed separately from the substrate. The first thin semiconductor film may include an array of semiconductor devices. The first and second thin semiconductor films may be replicated as arrays bonded to the same substrate.

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patent: 2002/0070382 (2002-06-01), Yamazaki et al.
patent: 2004/0089939 (2004-05-01), Ogihara et al.
patent: 10-063807 (1998-03-01), None

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