Combined rigid and flexible printed circuits and method of manuf

Details Combined rigid and flexible printed circuits and method of manuf Combined rigid and flexible printed circuits and method of manuf

1991-03-28

1993-04-27

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 428901, 29852, H05K 100

Patent

active

052064638

ABSTRACT:
This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material with a sheet of flexible over-layer material extending over at least the entirety of the conductors in all the flexible portions. A flexible adhesive material may adhesively attach the sheet of flexible over-layer material to the entirety of all the flexible portions and a rigid substrate material extends over the entirety of all the rigid portions. A rigid adhesive material may adhesively attach the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the rigid substrate material to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge. The sheet of flexible over-layer material may also extend over the rigid portions and be attached with a rigid adhesive.

REFERENCES:
patent: 4661417 (1987-04-01), Suzuki
patent: 4800461 (1989-08-01), Dixon et al.
patent: 4931134 (1990-06-01), Hatkevitz et al.
patent: 4997702 (1991-03-01), Gazit et al.
patent: 5004639 (1991-04-01), Desai

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