Combined RF and digital/DC signalling interconnect laminate

Details Combined RF and digital/DC signalling interconnect laminate Combined RF and digital/DC signalling interconnect laminate

1993-01-26

1995-01-24

Gensler, Paul

Wave transmission lines and networks

Plural channel systems

333243, 333246, H01P 500

Patent

active

053845552

ABSTRACT:
An interconnect laminate structure integrates RF and auxiliary (e.g. digital and D.C.) signalling capabilities in a common structure by means of a stacked conductor-plated dielectric configuration that facilitates access to and routing by channelline/waffleline RF transmission links and separate control (e.g. digital, power supply) links, without having to perform laborious manual routing tasks to effect auxiliary connectivity among the components of a network. The interconnect structure includes a first dielectric layer having a channel formed in a first surface thereof, the channel having a conductive surface and configured to accommodate the insertion of a dielectric coated conductor into the channel so as to form an RF transmission line. Second dielectric layers, each of which has a conductive layer formed on a first surface thereof, are mounted together with the first dielectric layer in a laminate assembly. Respective layers of adhesive are interleaved with the plurality of second dielectric layers together with the first dielectric layer in a laminate assembly.

REFERENCES:
patent: 3680005 (1972-07-01), Jorgensen et al.
patent: 4047132 (1977-09-01), Krajewski
patent: 4641140 (1987-02-01), Heckaman et al.
patent: 5150088 (1992-09-01), Virga et al.

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