Combined flat capacitor and tab integrated circuit chip and meth

Details Combined flat capacitor and tab integrated circuit chip and meth Combined flat capacitor and tab integrated circuit chip and meth

1990-06-18

1991-09-17

Hille, Rolf

357 70, H01L 2312, H01L 2314, H01L 2352

Patent

active

050499793

ABSTRACT:
A capacitor, having an area smaller than the top area of a chip, is attached above the top of a tape-automated-bonded (TAB) chip and short bonded wires or TAB leads interconnect the capacitor electrodes with the power and ground pads on the chip. The interconnections are made as short as possible, with a maximum distance therebetween and with the greatest number which will reduce the inductance of the leads. The power and ground pads may contain inwardly extending bonding regions for wire bonds or flip chip capacitor attachment.

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"TAB Technology Tackles High Density Interconnections", Electronic Packagig & Production, Dec. 1984, pp. 34-39.

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