Combined boards and methods for manufacturing the same

Details Combined boards and methods for manufacturing the same Combined boards and methods for manufacturing the same

2005-11-01

2005-11-01

Watkins, III, William P. (Department: 1772)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

C429S140000, C403S269000, C403S265000, C403S268000, C403S270000, C264S248000, C264S263000, C156S308400, C156S293000

Reexamination Certificate

active

06960383

ABSTRACT:
Combined boards are taught that comprise a second board substrate (12) having a through bore (14) formed therein, a first board substrate (10), and a connector pin (40, 50) received in the through bore (14) of the second board substrate (12). The first and second board substrates overlap such that the through bore (14) of the second board substrate (12) is covered by a first surface (10b) of the first board substrate (10). The connector pin is fusion bonded to a circumferential surface of the through bore (14) and the first surface (10b) of the first board substrate (10).

REFERENCES:
patent: 5190803 (1993-03-01), Goldbach et al.
patent: 5197935 (1993-03-01), Schweri
patent: 5393164 (1995-02-01), Renner et al.
patent: 19500790 (1996-07-01), None
patent: 893375 (1962-04-01), None
patent: 04331115 (1992-11-01), None
patent: 06339946 (1994-12-01), None
patent: 10044247 (1998-02-01), None
patent: 11-208271 (1999-08-01), None
patent: WO 79/00184 (1979-04-01), None

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