Combination strip frame for semiconductive device and gate for m

Metal working – Means to assemble or disassemble – Puller or pusher means – contained force multiplying operator

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Details

174 52PE, B32B 1500

Patent

active

039501400

ABSTRACT:
In the step of plastic encapsulation of a semiconductive device, the inner ends of a group of leads comprising part of a lead frame, the semiconductive chip and the connections between the chip and the inner ends of the leads, are put into a cavity of a mold and fluid encapsulating material is forced into the cavity to surround the elements that are in the cavity with encapsulating material. A lead frame, which may be supplied in strip form, is provided, a part of which is so formed as to act as a gate for the admission of fluid encapsulating material into the mold cavity.

REFERENCES:
patent: 3494022 (1970-02-01), Maute
patent: 3611061 (1971-10-01), Segerson

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