Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-03-14
2000-06-27
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29841, H01K 305
Patent
active
060802642
ABSTRACT:
An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one semiconductor die with a face surface having both flip chip type electric connections and bond pads for wirebonding or TAB attachment thereof to at least one leadframe. Another aspect of the present invention comprises using two pair of back to back attached dice with leadframe lead fingers disposed between the dice pairs. The die face surfaces adjacent to the lead fingers are in direct electrical communication therewith via flip-chip type connectors. Bond pads on the die face surface facing outward from the lead fingers are electrically connected to the leadframe via wire bonds and/or TAB.
REFERENCES:
patent: 4264917 (1981-04-01), Ugon
patent: 4701236 (1987-10-01), Vieilledent
patent: 4746392 (1988-05-01), Hoppe
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5146308 (1992-09-01), Chance et al.
patent: 5147815 (1992-09-01), Casto
patent: 5229647 (1993-07-01), Gnadinger
patent: 5239198 (1993-08-01), Lin et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5266833 (1993-11-01), Capps
patent: 5291061 (1994-03-01), Ball
patent: 5311057 (1994-05-01), McShane
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5331235 (1994-07-01), Chun
patent: 5340771 (1994-08-01), Rostoker
patent: 5399898 (1995-03-01), Rostoker
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5483024 (1996-01-01), Russell et al.
patent: 5484959 (1996-01-01), Burns
patent: 5491612 (1996-02-01), Nicewarner, Jr.
Lorin Francis J.
Micro)n Technology, Inc.
LandOfFree
Combination of semiconductor interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Combination of semiconductor interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Combination of semiconductor interconnect will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1781096