Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1996-05-20
1999-06-29
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257668, 257784, 257777, H01L 2348, H01L 23495, H01L 2352
Patent
active
059172428
ABSTRACT:
An apparatus and method for increasing integrated circuit density comprising utilizing chips with both direct (flip chip type) chip to conductors connection technology and wire bonds and/or TAB. An aspect of the present invention comprises at least one semiconductor die with a face surface having both flip chip type electric connections and bond pads for wirebonding or TAB attachment thereof to at least one leadframe. Another aspect of the present invention comprises using two pair of back to back attached dice with leadframe lead fingers disposed between the dice pairs. The die face surfaces adjacent to the lead fingers are in direct electrical communication therewith via flip-chip type connectors. Bond pads on the die face surface facing outward from the lead fingers are electrically connected to the leadframe via wire bonds and/or TAB.
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Arroyo Teresa M.
Micro)n Technology, Inc.
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