Combination of a support and a semiconductor body and method of

Details Combination of a support and a semiconductor body and method of Combination of a support and a semiconductor body and method of

1989-04-04

1990-05-29

Edlow, Martin H.

Fishing, trapping, and vermin destroying

357 26, 437222, H01L 2348, H01L 2944, H01L 2952

Patent

active

049299999

ABSTRACT:
The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body and the support. The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part, which is embedded in the metal layer.

REFERENCES:
patent: 2352640 (1944-07-01), Kotterman
patent: 3363308 (1968-01-01), Lueck
patent: 3422320 (1969-01-01), Woodling
patent: 3492545 (1970-01-01), Meyerhoff
patent: 3611064 (1971-10-01), Hall, II
patent: 3657611 (1972-04-01), Yoneda
patent: 3896542 (1975-07-01), Dale
patent: 4640438 (1987-02-01), Trevison et al.
patent: 4754316 (1988-06-01), Reid

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