Coating processes – Vacuum utilized prior to or during coating
Patent
1996-01-22
1998-05-26
Beck, Shrive
Coating processes
Vacuum utilized prior to or during coating
427421, 427425, 118326, 239113, 239120, 141 86, 141 93, 141128, B05D 300, B05B 128
Patent
active
057561559
ABSTRACT:
The invention provides a combination of a nozzle and a vacuum hood. The vacuum hood has a chamber that surrounds the tip of the nozzle and removes residue from the tip by a vacuum which flows in the chamber past the nozzle tip. This vacuum catches and removes residue from the nozzle tip and prevents the reside from interfering with the spraying action or dripping down. The method of the instant invention provides for dispensing a fluid from a nozzle without dripping fluid from the nozzle having a vacuum hood. The method comprises: (a) dispensing a fluid on a rotating semiconductor wafer through a nozzle over the wafer; (b) terminating the fluid flow through the nozzle; (c) creating an upward flow of gas about the dispensing nozzle when the flow of fluid through the nozzle is terminated; (d) capturing any fluid residue from the nozzle in the upward flow of gas; (e) removing the wafer and positioning another wafer; and (f) terminating the upward flow of gas; and repeating the process of steps (a) through (f).
REFERENCES:
patent: 3870089 (1975-03-01), Laub, III
patent: 4093123 (1978-06-01), Maran
patent: 4606382 (1986-08-01), Biller et al.
patent: 4832752 (1989-05-01), Nezworski
patent: 5147087 (1992-09-01), Fuchs
patent: 5250114 (1993-10-01), Konishi et al.
patent: 5255720 (1993-10-01), McPherson
Chang Cherng-Yui
Cheng Dong-Shiuh
Lin Yung-Kai
Tzeng Chung-Hao
Ackerman Stephen B.
Barr Michael
Beck Shrive
Saile George O.
Stoffel William J.
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