Electricity: measuring and testing – Testing potential in specific environment – Voltage probe
Reexamination Certificate
2001-05-24
2003-04-22
Le, N. (Department: 2858)
Electricity: measuring and testing
Testing potential in specific environment
Voltage probe
C324S149000, C324S754090
Reexamination Certificate
active
06552523
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates generally to measurement probes and more particularly to a combination low capacitance probe tip and socket for a measurement probe.
Voltage measurement probes couple an electrical signal from a device under test to a measurement test instrument, such as an oscilloscope and the like. Measurement probes include a probe head, a transmission line, such as a coaxial cable, and a connector housing having a signal connector, such as a BNC, SMA, BMA connector or the like, that connects to a mating signal connector on the measurement instrument. The probe head generally includes a metal tube or housing in which is disposed a substrate. A probing tip or socket is disposed in a holder that is inserted into one end of the probe head. The probe tip or socket extends from the holder and is electrically coupled to the substrate. The substrate has passive or active circuitry formed thereon that provides high impedance to the circuit generating the signal under test. The substrate circuitry is electrically coupled to the transmission line. The other end of the transmission line is electrically coupled to the signal connector.
High frequency measurement probes, such as those for probing signals in the 3 GHz to 4 GHz range, require high input impedance values and low input capacitances. Generally, these types of probes have an active transistor input stage for low circuit loading and have a frequency bandwidth up to 4 GHZ or more. An example of such a probe is the P6217 Active FET Probe, manufactured and sold by Tektronix, Inc., Beaverton, Oreg. and assignee of the instant application.
FIG. 1
 is a side-sectional view of the P6217 probe 
10
 showing the internal configuration of the probe elements. The probe 
10
 has an electrically conductive circular tubular housing 
12
 in which is disposed a substrate 
14
. The substrate is slightly off center in the tubular housing so that the upper surface of the substrate is centered in the housing. The end of the substrate 
14
 extends slightly outward from the end of the tubular housing and is tapered to provide clearance for a probe tip holder 
16
. Passive and active electrical components 
18
, such as bipolar transistors, resistors, capacitors and the like are mounted on the substrate. A gold foil contact 
20
 extends over the front end of the substrate 
14
 for providing an electrical connection between the substrate 
14
 and a probing tip 
22
. The probe tip holder 
16
 is made of insulating material, such as plastic or the like, and is secured within the end of the housing 
12
. The holder 
16
 has a cavity 
24
 with a tapered end 
26
 that receives a portion of the substrate 
14
 extending out past the end of the housing 
12
. The tapered end 
26
 is centrally formed in the holder 
16
 and has a bore 
28
 extending therefrom to the front end of the holder 
16
. The probing tip 
22
 has a head 
30
 and a shank 
32
 that is disposed in the holder 
16
 with the head 
30
 positioned in the tapered end 
26
 and the shank 
32
 extending through the bore 
28
 with the tip of the shank 
32
 exposed at the front end of the holder 
16
. A resilient elastomeric member 
34
 is disposed in the tapered end 
26
 between the probing tip head 
30
 and the holder to provide a compressive force between the head 
30
 and the gold foil contact 
20
 on the end of the substrate 
14
. An insulating boot 
36
 is positioned over a substantial portion of the tubular housing 
12
 to electrically insulate the housing 
12
 from the user.
Referring to 
FIG. 2
, there is shown a side-section view of another type of probe 
40
 having active circuitry. In this particular probe design, a socket 
42
 is provided in the probe tip holder 
44
. An example of such a probe is the P6245 Active probe, manufactured and sold by Tektronix, Inc., Beaverton, Oreg. The socket type active probe has a frequency bandwidth up to 1.5 GHz. The probe has a rectangular cross-section electrically conductive housing 
46
. A substrate 
48
 having active and passive circuitry 
49
 mounted thereon is mounted on a carrier 
50
 that is inserted into the housing 
46
. A gold foil contact 
52
 extends over the front end of the substrate 
48
 for providing an electrical connection between the substrate 
48
 and the socket 
42
. The probe tip holder 
44
 has a bore 
54
 there through in which is positioned the electrically conductive socket 
42
. An electrically conductive elastomeric material 
56
 is positioned between the socket 
42
 and the edge of the substrate 
48
 to electrically connect the socket to the circuit board and to provide a compressive force. A second socket 
58
 is positioned and electrically coupled to the housing 
46
 to provide a ground connection. An insulating boot 
60
 is positioned over a substantial portion of the housing 
46
 to electrically insulate the housing from the user. The socket 
42
 is designed to allow placement on square pin connectors mounted on a circuit board under test. Also, various types of probe tip adapters are provided with the probe for different types of probing operations. For example, a pointed tip may be inserted into the socket for placing the probe on circuit board traces, IC leads and the like.
A drawback to the socket style tip is that the metal socket diameter is much larger than the needle tip, so the socket is closer to the probe's metal tubular housing, increasing capacitance. The increased capacitance at the probe tip results in lower frequency bandwidth. Adding the various probe tip adapters further increases the tip capacitance. Likewise, adding a socket tip adapter to the probing tip of the higher frequency probe reduces the overall frequency bandwidth. What is needed is a measurement probe that allows both probing using a probing tip and a socket type connection, without the higher capacitance of a socket type connection.
SUMMARY OF THE INVENTION
Accordingly, the present invention is to a low capacitance probe tip and socket for a measurement probe having an insulating plug disposed in one end of a probe head. The insulating plug has a bore there through for receiving a low capacitance probe tip and a recess defining a socket. The socket has an aperture formed therein that provides access to the low capacitance probe tip. An electrically conductive contact is disposed in the aperture that extends into the socket and is in electrical contact with the low capacitance probe tip. In one embodiment, the socket is formed parallel to the low capacitance probe tip. The electrically conductive contact is then a spring contact formed on the probe tip and extends through the aperture into the socket. The spring contact is an electrically conductive beryllium-copper wire affixed to the probe tip and has a fold therein that extends through the aperture into the socket. In a further embodiment, the socket is formed at an angle to the low capacitance probe tip. The electrically conductive contact is then an electrically conductive elastomeric material disposed at the distal end of the socket in electrical contact with the low capacitance probe tip.
A measurement probe has a probe head that includes the low capacitance probe tip and socket. The probe head has a substrate disposed therein with probe circuitry formed on the substrate and an insulating plug disposed in one end of the probe head having a bore there through for receiving a low capacitance probe tip that is electrically coupled to the substrate. The insulating plug has a recess defining a socket with the socket having an aperture formed therein to access the low capacitance probe tip. An electrically conductive contact is disposed in the aperture that extends into the socket and is in electrical contact with the low capacitance probe tip. In one embodiment, the socket is formed parallel to the probe tip and in a further embodiment the socket is formed at an angle to the low capacitance probe tip. In the first embodiment, the electrically conductive element is a spring contact formed on the probe tip and extends through the aperture into t
Bucher William K.
Kerveros James C.
Le N.
Tektronix Inc.
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