Combination inductive coil and integrated circuit semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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Details

257679, 257790, 257666, 340572, 1521521, H01L 2900, H01L 2302, H01F 2706

Patent

active

059090502

ABSTRACT:
A combination inductive coil and integrated circuit semiconductor chip is provided in a single lead frame package. The lead frame is preferably made of a copper alloy and has a flat configuration. The chip is electrically connected to end portions of the inductive coil thus permitting the inductive coil to function as an antenna for the chip.

REFERENCES:
patent: 4857893 (1989-08-01), Carroll
patent: 5181975 (1993-01-01), Pollack et al.
patent: 5196725 (1993-03-01), Mita et al.
patent: 5541399 (1996-07-01), De Vall
patent: 5559360 (1996-09-01), Chiu et al.
patent: 5598032 (1997-01-01), Fidalgo

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