Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
1999-01-15
2001-01-30
Picardat, Kevin M. (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S121000, C438S123000, C438S124000
Reexamination Certificate
active
06180433
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to the use of passive devices with semiconductor devices and methods therefor and, more particularly, to a combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor.
BACKGROUND OF THE PRIOR ART
In the past, passive devices such as inductors, capacitors and resistors were combined with active devices such as diodes and transistors on a printed circuit board to manufacture electronic circuits and/or electronic systems.
As the technology developed, active devices of various types such as bipolar and MOS (or unipolar) devices became integrated into a single semiconductor chip. Integration of these active devices and also passive devices such as resistors and capacitors into a single semiconductor chip led to the formation of electrical circuits in a single semiconductor chip which became known as an integrated circuit semiconductor chip.
Packaging of such integrated circuit semiconductor chips became very important. As a result, integrated circuit semiconductor chip manufacturers have sought for ways to inexpensively and reliably package integrated circuit semiconductor chips.
One early packaging technique was to provide hybrid packages which usually incorporated integrated circuit semiconductor chips with passive devices such as capacitors and resistors on a ceramic substrate surface of a ceramic package which would have metal pins to permit the ceramic package to be inserted into via holes in a printed circuit board containing a number of such ceramic packages interconnected to provide either an electronic circuit or electronic system. Ceramic packages were very costly resulting in higher costs for a printed circuit board using multiple ceramic packages.
In an effort to significantly reduce manufacturing costs, lead frame packages were developed to protectively house integrated circuit semiconductor chips. A lead frame package generally comprised a metal lead frame member that would carry an integrated circuit semiconductor chip on a portion thereof. Wirebonding techniques were used to electrically connect terminal portions or pads of the integrated circuit semiconductor chip to fingers of the lead frame structure. Subsequently, the integrated circuit semiconductor chip on the lead frame structure with its wirebond connections thereto was encapsulated with plastic to provide a plastic encapsulated lead frame package. From a manufacturing cost point of view, plastic encapsulated lead frame packages were very inexpensive as compared to, for example, ceramic type packages.
A need existed to develop electronic type products that would be relatively inexpensive to make and that would take advantage of the lead frame manufacturing technology. Specifically, a need existed for improved lead frame type products that could perform functions that were not provided by the available lead frame products.
SUMMARY OF THE INVENTION
Accordingly, it is an object of this invention to provide an improved lead frame package and method.
It is a further object of this invention to provide an improved lead frame package and method which combines an integrated circuit semiconductor chip and a passive device in a single lead frame package.
It is another object of this invention to provide an improved lead frame package and method which combines an integrated circuit semiconductor chip and an inductor in a single lead frame package.
It is still another object of this invention to provide an improved lead frame package and method which combines an integrated circuit semiconductor chip and an inductive coil in a single lead frame package where the integrated circuit semiconductor chip is a transmitter.
It is another object of this invention to provide an improved lead frame package and method which combines an integrated circuit semiconductor chip in a single lead frame package where the integrated circuit semiconductor chip is a receiver and the inductive coil is the antenna for the receiver.
BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENTS
In accordance with one embodiment of this invention, a combination inductive coil and integrated circuit semiconductor chip is provided in a single lead frame package which comprises, in combination: a single package; a lead frame located in the single package and having a coil configuration, the lead frame located in one horizontal plane; and an integrated circuit semiconductor chip located in the single package and coupled to the lead frame and having at least one terminal pad electrically connected to at least one portion of the coil configuration of the lead frame. Preferably the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads of the integrated circuit semiconductor chip being electrically connected to one end portion of the coil configuration of the lead frame, the other of the two terminal pads of the integrated circuit semiconductor chip being electrically connected to the other end portion of the coil configuration of the lead frame.
In accordance with another embodiment of this invention, a method of combining an inductive coil and integrated circuit semiconductor chip in a single lead frame package is provided which comprises the steps of: providing a single package; providing a lead frame located in the single package and having a coil configuration, the lead frame located in one horizontal plane; and providing an integrated circuit semiconductor chip located in the single package and coupled to the lead frame and having at least one terminal pad electrically connected to at least one portion of the coil configuration of the lead frame.
The foregoing and other objects, features and advantages of this invention will be apparent from the following more particular description of the preferred embodiments of the invention as illustrated in the accompanying drawings.
REFERENCES:
patent: 5429992 (1995-07-01), Abbott et al.
patent: 5639694 (1997-06-01), Diffenderfer et al.
patent: 5683994 (1997-11-01), Joiner et al.
Fernandez Joseph
Furey Lee
Chichester Ronald L.
Collins D. M.
Frohwitter
Katz Paul N.
Microchip Technology Incorporated
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