Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-06-13
2006-06-13
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S752000, C361S753000, C165S080300
Reexamination Certificate
active
07061766
ABSTRACT:
A system and method for providing a mechanical joint supporting a printed circuit board and a solder joint of power module terminals to a printed circuit board, as well as a mechanical joint for facilitating a thermal interface between a power module and a heat sink or cold plate is disclosed. The system provides for both mechanical joints through a common mechanical support including a plurality of standoffs mounted to studs projecting from a heat sink or cold plate, wherein the assembly also provides for an insulating spacer to be clamped to the standoffs via a wing nut or similar fastener to support the printed circuit board.
REFERENCES:
patent: 5227631 (1993-07-01), Hunter et al.
patent: 5608611 (1997-03-01), Szudarek et al.
patent: 6181561 (2001-01-01), Albrecht et al.
patent: 6280202 (2001-08-01), Alden et al.
patent: 6377461 (2002-04-01), Ozmat et al.
patent: 6483708 (2002-11-01), Ali et al.
patent: 6493233 (2002-12-01), De Lorenzo et al.
patent: 6771507 (2004-08-01), Belady et al.
patent: 6839240 (2005-01-01), Skofljanec et al.
Kersting James K.
Wainwright Richard E.
Datskovskiy Michael
Hamilton Sunstrand Corporation
Kinney & Lange , P.A.
LandOfFree
Combination IGBT mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Combination IGBT mounting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Combination IGBT mounting method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3694424