Combination heat sink and air duct for cooling processors with a

Details Combination heat sink and air duct for cooling processors with a Combination heat sink and air duct for cooling processors with a

1996-10-08

1998-10-27

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 361690, H05K 720

Patent

active

058285490

ABSTRACT:
A method and apparatus for dissipating heat from an electrical device and ducting air from one place to another. In a computer having several heat producing devices, one heat sink is thermally attached to each one of the devices. Each of the heat sinks has a base, two side walls and a top wall forming a passage therebetween. The base, side and top walls are all thermally conductive to the corresponding heat producing device, and therefore each of them radiate heat into the passage. Each of the heat sinks also includes several cooling fins that extend into the passage, thereby increasing the thermal efficiency of the heat sink. Furthermore, the passage is of sufficient size to allow multiple heat sinks to be serially lined up, thereby allowing an air mass to flow from one heat sink to another.

REFERENCES:
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patent: 5493457 (1996-02-01), Kawamura et al.
IBM Technical Disclosure Bulletin authored by R.E. Simons, entitled Micro-Modular Air-Cooling Scoop, dated Jun. 1979, pp. 240-241.

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