Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-20
2000-04-11
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361710, 361719, 361816, 257707, 257719, 174 35R, 438122, H05K 900
Patent
active
060494697
ABSTRACT:
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, such as a CPU, in a computer system includes a first surface thermally coupling the apparatus to an integrated circuit (IC). The apparatus, including the first surface, is of a material, such as some alloys of beryllium copper, with a yield strength of at least 80,000 pounds per square inch and with a thermal conductivity of at least 220 watts/meter*degree (Kelvin). The material is electrically conductive.
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Broder Damon W.
Holloway Eric B.
Hood, III Charles D.
Dell USA L.P.
Dolezal David G.
Tolin Gerald
Vigushin John B.
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