Combination bake/chill apparatus incorporating low thermal mass,

Details Combination bake/chill apparatus incorporating low thermal mass, Combination bake/chill apparatus incorporating low thermal mass,

1998-03-05

2000-06-06

Paschall, Mark

Electric heating

Heating devices

With power supply and voltage or current regulation or...

21912143, 21912158, 219494, 118724, 374 1, 392416, 438660, H04B 102

Patent

active

060721634

ABSTRACT:
Systems and methods that make it possible to rapidly cycle a workpiece through a temperature/time profile over a wide temperature range, e.g., 0.degree. C. to 350.degree. C., without having to lift and transfer the workpiece between separate baking and chilling mechanisms. The present invention is based in part upon the concept of using a low thermal mass, thermally conductive heating member to support a workpiece, such as a microelectronic device, during both baking and chilling operations. While supporting the workpiece on one surface, the other surface of the heating member can be brought into and out of thermal contact with a relatively thermally massive chill plate to easily switch between baking and chilling operations. A simple mechanism is all that is required to either physically separate the heating member and chill plate to accomplish the most rapid heating, or the simple mechanism adjoins the heating member and chill plate to accomplish the most rapid chilling. This approach completely eliminates the need to rely upon a workpiece handling mechanism in order to lift and transfer a microelectronic device from a heating member to a separate chill plate. This approach also allows both chilling and baking to occur from a direction below the microelectronic device.

REFERENCES:
patent: 3612165 (1971-10-01), Haynes
patent: 3956936 (1976-05-01), Brixy
patent: 3966500 (1976-06-01), Brixy
patent: 4030015 (1977-06-01), Herko et al.
patent: 4113391 (1978-09-01), Minowa
patent: 4443117 (1984-04-01), Muramoto et al.
patent: 4475823 (1984-10-01), Stone
patent: 4486652 (1984-12-01), Muka et al.
patent: 4627744 (1986-12-01), Brixy et al.
patent: 4903754 (1990-02-01), Hirscher et al.
patent: 5226472 (1993-07-01), Benevelli et al.
patent: 5252807 (1993-10-01), Chizinsky
patent: 5291514 (1994-03-01), Heitmann et al.
patent: 5410162 (1995-04-01), Tigelaar et al.
patent: 5411076 (1995-05-01), Matsunaga et al.
patent: 5484011 (1996-01-01), Tepman et al.
patent: 5567267 (1996-10-01), Kazama et al.
patent: 5584971 (1996-12-01), Konino
patent: 5595241 (1997-01-01), Jelinek
patent: 5802856 (1998-09-01), Schaper et al.
patent: 5892207 (1999-04-01), Kawamura et al.
Basics of Design Engineering, "DSPs find a place in motor control," pp. 95-95-96, 98, 100-102, Nov. 6, 1997.

Affiliated with

Also associated with

Rating

Combination bake/chill apparatus incorporating low thermal mass, does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Combination bake/chill apparatus incorporating low thermal mass,, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Combination bake/chill apparatus incorporating low thermal mass, will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2215114