Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-12-05
2006-12-05
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S780000, C257S782000, C257SE21509, C257SE23067
Reexamination Certificate
active
07145251
ABSTRACT:
The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
REFERENCES:
patent: 3989605 (1976-11-01), Yanagida et al.
patent: 6136434 (2000-10-01), Jang et al.
patent: 2004/0164413 (2004-08-01), Hall et al.
Chung Ji Young
Park Chan Yeok
Ryu Sang Hyun
Amkor Technology Inc.
Le Dung A.
Moy Jeffrey D.
Weiss Harry M.
Weiss & Moy P.C.
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