Colorant resin composition

Details Colorant resin composition Colorant resin composition

1996-08-07

1999-04-06

Warzel, Mark L.

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

524 88, 524104, 524105, 524517, 524522, 524528, B29D 2300

Patent

active

058915397

ABSTRACT:
A molded article or water-supply pipe free from causing dot-like projections or small-diameter blisters on the molded article surface when the molded article is brought into contact with chlorine-containing water is obtained from a resin composition containing a polyolefin resin, a pigment and a copolymer resin obtained from a monomer having an .alpha.,.beta.-unsaturated double bond and a dibasic acid having an unsaturated double bond or an anhydride thereof.

REFERENCES:
Patent Abstracts of Japan, vol. 017, No. 644 (C-1134), Nov. 30, 1993 & JP-A-05 202234 (Toyo Ink Mfg Co Ltd), Aug. 10, 1993 *abstract*.
Database WPI, Section Ch, Week 9336, Derwent Publications Ltd., London, GB; Class A18, AN 93-285508, & JP-A-05 202 234 (Toyo Ink), Aug. 10, 1993 *abstract*.
Patent Abstracts of Japan, vol. 013, No. 255 (C-606), Jun. 13, 1989 & JP-A-01 056747 (Mitsubishi Petrochem Co Ltd), Mar. 3, 1989 *abstract*.
Database WPI, Week 8915, Derwent Publications Ltd., London, GB; AN 89-110677, & JP-A-01 056 747 (Mitsubishi Petrochem), Mar. 3, 1989 *abstract*.
Patent Abstracts of Japan, vol. 015, No. 034 (C-0799), Jan. 28, 1991, & JP-A-02 272044 (Ube Ind Ltd), Nov. 6, 1990, *abstract*.
Database WPI, Section Ch, Week 9050, Derwent Publications Ltd., London, GB; Class A17, AN 90-373594 & JP-A-02 272 044 (Ube Industries), Nov. 6, 1990 *abstract*.

Affiliated with

Also associated with

Rating

Colorant resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Colorant resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Colorant resin composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1369287