Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2005-05-03
2005-05-03
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S779000, C257S780000, C438S646000, C438S647000, C438S648000
Reexamination Certificate
active
06888242
ABSTRACT:
The surface of a solder ball and a conductive wire for a semiconductor package are coated with a predetermined colorant. Various colorants may be used according to the diameter and metal composition of the solder ball and the conductive wire. The colorant is formed by mixing organic compound and dye of a predetermined color. Examples of organic compounds excellent in physicochemical bonding with metal include benzotriazole, alkylimidazole and benzimidazole. The solder ball is fabricated by coating an organic compound of a predetermined color on the surface of a typical solder ball. The conductive wire is fabricated by coating an organic compound of a predetermined color on a general conductive wire between heat process and winding. Moreover, the solder ball is evaporated in a reflowing step after bumped via flux and the conductive wire is evaporated in a wire bonding step so that the solder ball and the conductive wire return to their unique colors.
REFERENCES:
patent: 6312498 (2001-11-01), Lee et al.
patent: 6517602 (2003-02-01), Sato et al.
patent: 6540129 (2003-04-01), Lee
patent: 6805914 (2004-10-01), Clark et al.
Chung Ji Young
Park Chan Yeok
Ryu Sang Hyun
Amkor Technology Inc.
Le Dung A.
Weiss, Moy & Harris P.C.
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