Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate
Patent
1997-11-06
2000-11-21
Koslow, C. Melissa
Abrasive tool making process, material, or composition
With inorganic material
Clay, silica, or silicate
51309, 216 89, B24B 2902
Patent
active
061496960
ABSTRACT:
A novel colloidal silica slurry including additives for enhancing the removal rate of a metallic workpiece, preventing etch pits, and enhancing smoothness. These additives include HNO.sub.3, H.sub.2 O.sub.2 and Al(NO.sub.3).sub.3. In lieu of colloidal silica, colloidal alumina can be used. The metallic workpiece can be NiP, Ni, Al or other appropriate materials.
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Komag, Inc.
Koslow C. Melissa
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