Colloidal silica slurry for NiP plated disk polishing

Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate

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51309, 216 89, B24B 2902

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active

061496960

ABSTRACT:
A novel colloidal silica slurry including additives for enhancing the removal rate of a metallic workpiece, preventing etch pits, and enhancing smoothness. These additives include HNO.sub.3, H.sub.2 O.sub.2 and Al(NO.sub.3).sub.3. In lieu of colloidal silica, colloidal alumina can be used. The metallic workpiece can be NiP, Ni, Al or other appropriate materials.

REFERENCES:
patent: 3385682 (1968-05-01), Lowen
patent: 4705566 (1987-11-01), Senda et al.
patent: 4769046 (1988-09-01), Senda et al.
patent: 4954142 (1990-09-01), Carr et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5167096 (1992-12-01), Eltoukhy et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5230833 (1993-07-01), Romberger et al.
patent: 5246624 (1993-09-01), Miller et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5352277 (1994-10-01), Sasaki
patent: 5366542 (1994-11-01), Yamada et al.
patent: 5571373 (1996-11-01), Krishna et al.
patent: 5575837 (1996-11-01), Kodama et al.
patent: 5643837 (1997-07-01), Hayashi
patent: 5658659 (1997-08-01), Chen et al.
patent: 5700383 (1997-12-01), Feller et al.
patent: 5709588 (1998-01-01), Muroyama
patent: 5738800 (1998-04-01), Hosali et al.
patent: 5759917 (1998-06-01), Grover et al.
patent: 5783489 (1998-07-01), Kaufman et al.
patent: 5804513 (1998-09-01), Sakatani et al.
patent: 5858813 (1999-01-01), Scherber et al.
patent: 5916819 (1999-06-01), Skrovan et al.
patent: 5935278 (1999-08-01), Ishitobi et al.
Carpio et al, "Initial Study on Copper CMP slurry Chemistries", Thin Solid Films, 266, pp. 238-244, 1995.
Carpio, R. et al "Initial Study on Copper CMP Slurry Chemistries" Thin Solid Film 1995, pp. 238-244 no month.
Sabde, G.M. Slurry Development For Chemical Mechanical Polishing of Tungsten, CMP-MIC Conference, no month 1997, pp. 331-334.
Pohl, M., et al., "The Importance of Particle Size to the Performance of Abrasive Particles in the CMP Process", Journal of Electronic Materials, vol. 25, Nov. 10, 1996, pp. 1612-1616.
Material Safety Data Sheet, 1996 no month.
Vander Voort, G.F., "Polishing With Colloidal Silica", 1997, pp. 1-13 no month.
Ali, I., et al., "Chemical-13 Mechanical Polishing of Interlayer Dielectric: A review", Solid State Technology Oct. 1994, pp. 63-70. no month or year.
Niernynck, J.M., et al., The Addition of Surfactant to Slurry for Polymer CMP: Effects on Polymer Surface, Removal Rate and Underlying Cu, Thin Solid Films, 1996 pp. 447-452. no month or year.
Talke, F., "On Tribological Problems in Magnetic Disk Recording Technology", UCSD, Center for Magnetic Recording Research, pp. 18-25. no month or year.
Hu, Z. Y. et al. "Chemical-Mechanical Polishing of PECVD Silicon Nitride" Thin Solid Films, 1996, pp.453-457. no month or year.
Ali, Iqbal, et al., "Charged Particles in Process Liquids", Semiconductor International, Apr. 1990, pp. 92-95.

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