Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate
2005-02-08
2005-02-08
Klemanski, Helene (Department: 1755)
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate
active
06852152
ABSTRACT:
A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
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Galasco Raymond T.
Magnuson Roy H.
Markovich Voya R.
Miller Thomas R.
Sargent Anita
International Business Machines - Corporation
Klemanski Helene
Scully Scott Murphy & Presser
Steinberg William H.
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