Colloidal metal dispersion, and a colloidal metal complex

Details Colloidal metal dispersion, and a colloidal metal complex Colloidal metal dispersion, and a colloidal metal complex

1987-05-07

1989-12-19

Lilling, Herbert J

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having semi-insulating component

427214, 427216, 427221, 428407, 523205, 523206, 523375, A61K 4700, B01J 1300, C12N 1114, C08K 910

Patent

active

048882488

ABSTRACT:
There is disclosed a novel colloidal metal dispersion in which colloidal particles of a metal are protected by specific polymers including hydrazide polymers, acrylic ester polymers and acrylamide polymers. The colloidal metal dispersion is highly stable, and the colloidal metal particles protected by such specific polymers can be easily and strongly bound to various amino group-containing compounds to give stable colloidal metal complexes, which have a wide variety of uses, such as the use as a solid catalyst, the use for the treatment and diagnosis of various diseases, the use for studying tissues of living bodies, the use for including mutation of microorganisms, etc.

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"Kobunshi Shokubai no Kogyoka (Industrialization of Polymer Catalyst)" pp. 151-179 (1981) published by CMC Co., Ltd., Japan.

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