Colloidal compositions for electroless deposition stabilized by

Details Colloidal compositions for electroless deposition stabilized by Colloidal compositions for electroless deposition stabilized by

1980-04-04

1982-01-05

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 111, 252302, 252308, 252313R, 427 98, 427304, 427305, 427306, C23C 302

Patent

active

043094546

ABSTRACT:
Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

REFERENCES:
patent: 3657003 (1972-04-01), Kenney
patent: 4278712 (1981-07-01), Thomann
Pearlstein, Modern Electroplating, pp. 710-719; 734-735, c1974, John Wiley & Sons Inc.
Weiser, Inorganic Colloid Chemistry, vol. 1, pp. 1-5, 137-143, and vol. 2, pp. 149-170, c1933.

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