Colloidal compositions for electroless deposition comprising col

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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106 111, 427 98, 427304, 427305, 427306, 427307, C23C 302

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active

043271251

ABSTRACT:
Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

REFERENCES:
patent: 3958048 (1976-05-01), Donovan
patent: 3993491 (1976-11-01), Feldstein
patent: 4160050 (1979-07-01), Nuzzi
Weiser, "Inorganic Colloid Chemistry", vol. 1, pp. 1-5, 137-143, John Wiley & Sons, .COPYRGT.1933.

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