Colloidal compositions for electroless deposition

Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

106 111, 106 125, 10628718, 10628719, 10628735, 427304, 427305, 428457, C23C 302

Patent

active

050099655

ABSTRACT:
Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless(chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

REFERENCES:
patent: 3958048 (1976-05-01), Donovan et al.
patent: 3993799 (1976-11-01), Feldstein
patent: 3993801 (1976-11-01), Feldstein
patent: 3993848 (1976-11-01), Feldstein
patent: 4087586 (1978-05-01), Feldstein
patent: 4265942 (1981-05-01), Feldstein
patent: 4309454 (1982-09-01), Feldstein
patent: 4325983 (1982-04-01), Feldstein
patent: 4327125 (1982-04-01), Feldstein

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Colloidal compositions for electroless deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Colloidal compositions for electroless deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Colloidal compositions for electroless deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1620821

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.