Collimated metal deposition

Details Collimated metal deposition Collimated metal deposition

1989-07-06

1991-06-18

Cashion, Jr., Merrell C.

Stock material or miscellaneous articles

Composite

Of polyimide

428620, 428601, 428901, 430273, 430312, 174254, B32B 2708

Patent

active

050248960

ABSTRACT:
A process and structure for depositing metal lines in a lift-off process is disclosed. The process comprises the deposition of a four-layer structure or lift-off stencil, comprising a first layer of a lift-off polymer etchable in oxygen plasma, a first barrier layer of hexamethyldisilizane (HMDS) resistant to an oxygen plasma, a second lift-off layer and a second barrier layer. Once these layers are deposited, a layer of photoresist is deposited and lithographically defined with the metal conductor pattern desired. The layers are then sequentially etched with oxygen and CF.sub.4, resulting in a dual overhang lift-off structure. Metal is then deposited by evaporation or sputtering through the lift-off structure. Following metal deposition, the stencil is lifted-off in a solvent such as N-methylpyrrolidone (NMP).

REFERENCES:
patent: 4493855 (1985-01-01), Sachdev et al.
patent: 4519872 (1985-05-01), Anderson et al.
patent: 4692205 (1987-09-01), Sachdev et al.
Hafner, et al., "Method of Producing Contact Metallizations", IBM Technical Disclosure Bulletin, vol. 24, No. 12, May 1982, p. 6483.

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